Expanding Bandwidth in HFC Networks The Role of 1.8 GHz Diplex Filters

As hybrid fiber-coaxial (HFC) networks evolve toward higher bandwidth and faster data rates, components that support extended frequency ranges are becoming increasingly important. The move from 1.2 GHz to 1.8 GHz spectrum marks a significant upgrade in broadband infrastructure, enabling operators to deliver more capacity without a full system overhaul.
One key component in this transition is the CATV diplex filter, which separates upstream and downstream signals within a shared transmission path.

 

Why the Diplex Filter Matters

In cable and broadband systems, both forward (downstream) and return (upstream) signals travel through the same network but occupy different frequency ranges.
To prevent interference, a diplex filter acts as a frequency divider — it passes one range while blocking the other. This ensures that each direction of communication remains isolated, maintaining signal clarity and network stability.

As the industry expands toward 1.8 GHz, traditional filters are no longer sufficient. Wider bandwidth demands improved isolation, lower insertion loss, and greater mechanical precision to ensure compatibility with upgraded amplifiers and optical nodes.

 

Design Considerations for 1.8 GHz Networks

When designing or upgrading CATV systems for 1.8 GHz operation, engineers typically look at three key aspects:

  1. Crossover Frequency (Split Point)
    Depending on the system architecture, different frequency splits are used — such as 5–85 MHz https://www.sanlandtech.com 102–1794 MHz, or 5–204 MHz https://www.sanlandtech.com 258–1794 MHz. Each combination serves different upstream bandwidth requirements.

  2. Isolation & Insertion Loss
    The filter must maintain high isolation between return and forward paths while keeping insertion loss minimal. Poor performance in either metric can lead to distortion, cross-talk, or reduced network efficiency.

  3. Mechanical and Environmental Factors
    Compact “plug-in” designs simplify maintenance and integration in dense network environments. At the same time, RoHS compliance and robust mechanical structure ensure long-term stability in the field.

    A Practical Example: 1.8 GHz CATV Diplex Filters

    A good example of such design evolution can be seen in the 1.8 GHz CATV Diplex Filter series by Sanland.
    This series includes several band-split options (e.g., 5–85 MHz https://www.sanlandtech.com 102–1794 MHz, 5–204 MHz https://www.sanlandtech.com 258–1794 MHz, 5–396 MHz https://www.sanlandtech.com 492–1794 MHz) to support diverse network plans.
    Each model is optimized for low insertion loss, high isolation, 75 Ω impedance, and a slim plug-in structure suitable for compact modules and headend applications.

     

    Future Outlook

    As operators continue extending HFC bandwidth toward 1.8 GHz and beyond, diplex filters will remain essential in ensuring reliable upstream and downstream coexistence.
    Developments in filter topology, materials, and precision manufacturing will further enhance performance and enable smooth migration to next-generation networks.

     

    For more technical details about 1.8 GHz filter solutions, Click here!

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Invitation | Explore the Future of Intelligent Manufacturing, Join the CIIF

Gathering new industrial momentum and leading the future of intelligent manufacturing, the China International Industry Fair (CIIF), a global event in the automation field, will once again bring together top enterprises and cutting-edge technologies to showcase core products and solutions for intelligent manufacturing. We sincerely invite you to join us at this grand event, witness the innovative achievements together, and explore new opportunities for cooperation.

 

Date: September 23 - 27, 2025
Location: National Exhibition and Convention Center (Shanghai, China)
Booth Number: E023, Hall 5.1

 

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WAIN High-Temperature Series Connectors

In today’s era of rapid technological development, the performance and reliability of electronic components and devices have become the core focus of attention. This is especially true for devices operating in extreme environments, such as aerospace, automotive engine management, energy equipment, and oil drilling. For these applications, connector standards have reached a new level. In response to these challenges, WAIN Electrical has introduced high-temperature connectors (200℃), designed to maintain performance and reliability under extreme temperature conditions.

WAIN High-Temperature Series Connectors are certified in accordance with the DIN EN 60 664 / DIN EN 61 994 standards.

High-Temperature Series Connectors

 

Product Advantages

01

High Reliability

Even in extreme temperature fluctuations, WAIN high-temperature series connectors provide stable power transmission and signal conduction.

 

02

Long Service Life

Made from high-quality materials and rigorously tested, WAIN high-temperature connectors have a long service life, reducing maintenance costs.

 

03

Strong Applicability

Whether exposed to continuous high temperatures or transient temperature rises, WAIN high-temperature connectors operate normally and are suitable for a variety of complex applications.

 

04

High Safety

With an IP65/IP67 protection rating, WAIN high-temperature connectors further enhance safety during use.

 

Technical Parameters

Number of Contacts:6,10,16,24

Rated Current:16A

Rated Voltage:500V

Rated Pulse Voltage:6kV

Contact Resistance:≤1mΩ

Wire Gauge:0.75-2.5mm²(18-14AWG)

Shell Protection Rating:IP65/IP67

Mating Cycles:≥500

Temperature Range:-40℃~+200℃

Contact Material:Copper Alloy

Connection Type:Screw Connection

Contact Plating: Gold/Silver Plating

Insulation Material:LCP

Sealing Component:FPM

Shell Material:Die-Cast Aluminum

 

China industrial connectors manufacturer

 

All components of the WAIN high-temperature series connectors (including contacts, inserts, shells, seals, and grounding elements) are designed using high-temperature resistant materials, ensuring the product can operate stably within the specified temperature range.

 

·END·

 

WAIN is not only manufacturing, but also creating!

Any questions and ideas related to industrial connectors,

we welcome to discuss with you.

 

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Top Scanning Electron Microscopes (SEM) Used by Italian Researchers in 2025

Italy has long been a hub for innovation in materials science, nanotechnology, and cultural heritage preservation. Across the country’s universities and national research centers, scanning electron microscopy (SEM) plays a central role in analyzing microstructures and surface morphologies with high precision. In 2025, the demand for advanced SEM systems in Italy continues to rise, driven by the pursuit of higher resolution, improved automation, and multi-mode analytical capabilities.

 

SEM as a Core Tool in Italian Research

From the Politecnico di Milano to the National Research Council (CNR) and major materials institutes in Emilia-Romagna, SEM has become indispensable for both academic and industrial research. Italian laboratories rely on these systems to study metals, ceramics, semiconductors, biological samples, and even ancient artifacts.

Recent years have seen a shift from conventional tungsten SEMs to field emission SEM (FE-SEM) platforms, which deliver higher spatial resolution and more stable imaging performance. This evolution reflects the country’s growing focus on nanostructured materials, energy devices, and precision manufacturing — all areas where nanoscale imaging and analysis are crucial.

 

Performance Priorities for Italian SEM Users

Italian researchers tend to emphasize several practical factors when evaluating SEM systems:

  • Resolution and imaging stability: The ability to observe nanoscale details in materials such as thin films, catalysts, and nanocomposites.

  • Analytical integration: Compatibility with EDS, EBSD, and WDS systems to extract chemical and crystallographic information alongside morphology.

  • Ease of operation and automation: Software-guided imaging and recipe-based workflows are increasingly preferred in multi-user facilities.

  • Temperature and environmental control: In-situ observation of microstructural evolution under heating or vacuum changes is becoming more common.

  • Service and long-term support: Access to local technical expertise and responsive maintenance is a key factor in supplier selection.

These priorities reflect a broader trend: Italian laboratories are modernizing not only their instrumentation but also their workflow efficiency and data reliability.

 

Modern SEM Systems Entering the Italian Market

In recent years, CIQTEK’s SEM instruments have been increasingly adopted by research and industrial users across Italy. Several systems, including the SEM3200 and SEM3300, have been installed through CIQTEK’s local partner in Rome. It has also established a dedicated CIQTEK SEM demonstration laboratory, where Italian researchers can experience the imaging performance and analytical capabilities of the systems firsthand. These installations highlight the country’s growing interest in high-resolution, stable, and user-friendly SEMs supported by local expertise.

CIQTEK SEM Systems at the Italian Market

 

A Growing Ecosystem for Advanced Electron Microscopy

Italy’s strong tradition in materials and applied sciences continues to drive demand for advanced electron microscopy. National research centers, universities, and technology companies are jointly shaping a dynamic environment where innovation in imaging and analysis thrives.

With more international suppliers now offering localized support and demonstration facilities, such as CIQTEK’s growing presence through its partner network, Italian users have access to an expanding ecosystem of high-performance, reliable SEM solutions. In addition to advanced imaging quality and stable performance, CIQTEK SEM systems are recognized for their competitive pricing, making high-end field emission microscopy more accessible to a wider range of research and industrial users.

This growing accessibility, combined with strong local technical support, ensures that Italy remains at the forefront of microscopy research and application in Europe, where precision, performance, and affordability converge to empower the next generation of scientific discovery.

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CIQTEK FESEM SEM4000Pro Installed at SYNERGIE4 Showroom — A New Step in Europe

CIQTEK has taken another important step forward in Europe with the installation of the SEM4000Pro Field Emission Scanning Electron Microscope (FE-SEM) at the SYNERGIE4 demonstration showroom in France.

The new setup allows researchers and industrial users in Europe to experience high-resolution imaging, analytical performance, and ease of operation offered by the CIQTEK SEM4000Pro. The system provides outstanding image quality for fine microstructural observation and supports a wide range of applications in materials science, microelectronics, and R&D.

 

 

SYNERGIE4 is CIQTEK's French distributor and service provider for advanced microscopy and microanalysis solutions. With extensive experience in electron microscopy and analytical instruments, SYNERGIE4 supports universities, research institutes, and industrial labs across France with tailored solutions, technical expertise, and training.

Now, SYNERGIE4’s demo center features a fully operational CIQTEK SEM4000Pro, offering hands-on demonstrations for visitors to explore its imaging capabilities, intuitive software interface, and versatility across various research fields.

 

“Having the CIQTEK SEM4000Pro available in our showroom allows us to showcase its imaging performance directly to our customers,” said a representative from SYNERGIE4. “It’s a great addition to our demonstration facilities and an important step in expanding our microscopy portfolio.”

 

With the SEM4000Pro now available in France, European users can directly evaluate its performance, supported by SYNERGIE4’s local expertise and technical demonstration services. This collaboration marks a significant milestone in CIQTEK’s ongoing effort to enhance accessibility to advanced electron microscopy technologies across Europe.

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From Lab to Field CIQTEK Showcases Next-Generation Instruments at ARABLAB 2025

From September 23 to 25, 2025, CIQTEK made a strong impression at ARABLAB 2025, held at the Dubai World Trade Center. At Booth H1-C24 in Sheikh Saeed Hall 1, we demonstrated our latest scientific instruments and oilfield technologies to a diverse international audience.

CIQTEK Showcases Next-Generation Instruments at ARABLAB 2025

 

Highlights & Achievements

  • Comprehensive Portfolio Displayed
    We presented flagship systems in electron microscopy (FIB/SEM, TEM), nuclear magnetic resonance (NMR) spectrometers, and BET surface area & porosimetry analyzers—underscoring our commitment to advancing analytical science.

  • Integration of Oilfield Solutions under the QOILTECH Brand
    Under our specialized QOILTECH line, we introduced tools for petroleum exploration, including RSS, MWD/LWD systems, and near-bit gamma tools. These offerings were well received by participants seeking robust instrumentation for extreme environments.

  • Strong Engagement & Feedback
    At the booth, we addressed technical queries and shared success stories from across the research and industry sectors. Many attendees expressed interest in follow-up collaborations, demos, and trial opportunities.

  • Global Networking & Partnerships
    ARABLAB 2025 brought together distributors, end-users, and scientific institutions from across the world. CIQTEK strengthened relationships and opened dialogues for future regional projects and partnerships in the Middle East and beyond

 

 

CIQTEK thanks all visitors, partners, and colleagues who joined us in Dubai!

We look forward to continued collaboration and impactful research ahead!

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CIQTEK Unveils 4D-STEM Solution for Advanced Electron Microscopy

Four-dimensional scanning transmission electron microscopy (4D-STEM) is one of the most cutting-edge directions in electron microscopy. By performing a two-dimensional scan across the sample surface while recording a full diffraction pattern at each scan point with a pixelated detector, 4D-STEM generates a four-dimensional dataset containing both real-space and reciprocal-space information.

This technique breaks through the limitations of conventional electron microscopy that typically collects only a single scattering signal. Instead, it captures and analyzes the entire spectrum of electron–sample interactions. With 4D-STEM, researchers can achieve multiple advanced functionalities within a single experiment, including virtual imaging, crystal orientation and strain mapping, electric and magnetic field distribution analysis (differential phase contrast), and even atomic-resolution reconstruction through diffraction stacking. It greatly expands the dimensionality and depth of materials characterization, offering an unprecedented tool for nanoscience and materials research.

 

At the Chinese National Conference on Electron Microscopy 2025 (Sept 26–30, Wuhan), CIQTEK releases its 4D-STEM solution, designed to break through the boundaries of traditional imaging and deliver data with unmatched dimensionality and analytical power.

 

System Workflow

CIQTEK Unveils 4D-STEM Solution for Advanced Electron Microscopy-workflow

 

The CIQTEK 4D-STEM solution features high spatial resolution, multi-dimensional analysis, low-dose operation to minimize beam damage, and flexible data processing, providing researchers with reliable and outstanding methods for advanced materials analysis.

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CIQTEK Launches In-situ Mechanical Testing Solution – An Open R&D Platform for Multi-Scenario Research

Research on the microscopic behavior of materials is entering a new era of multi-scenario coupling and in-situ dynamic characterizationCIQTEK has launched an innovative In-situ Mechanical Testing Solution, designed with outstanding openness and compatibility. It enables seamless integration of CIQTEK’s full range of electron microscopes with mainstream in-situ testing devices, providing a flexible and efficient platform for coupled analysis in diverse research scenarios.

 

Breaking the limitations of closed systems, the solution integrates all critical elements required for in-situ EM adaptability, featuring:

  • High beam current: >100 nA, ideal for fast EDS/EBSD analysis

  • Large space: 360 × 310 × 288 mm (L × W × H)

  • High load capacity: 5 kg (up to 10 kg with custom fixtures)

  • Multi-view CCDs: ensuring system safety during in-situ operation

  • Multiple interfaces: supporting customized flange accessories

  • Pre-acceptance: full accessory debugging before delivery, ensuring complete functionality without on-site installation issues

The solution can be configured across CIQTEK’s full range of electron microscopy products, including CIQTEK SEM3200SEM5000XDB550 dual-beam systems, and more. It also offers seamless compatibility with tensile stages, heating stages, nanoindenters, and electrochemical workstations from world-leading suppliers. This open architecture enables researchers to flexibly combine the most suitable equipment, maximizing experimental performance.

 

CIQTEK’s in-situ stage solution supported customers in publishing a high-impact paper (DOI: 10.1126/science.adq6807).

CIQTEK In-situ Mechanical Testing Solution for SEM

 

CIQTEK’s In-situ Mechanical Solution also supports multi-field coupling (mechanical, thermal, electrochemical), enabling nanoscale real-time observation of materials under complex environments. By synchronizing high-resolution imaging with in-situ signals, researchers can capture critical phenomena such as crack propagation, phase transitions, and interfacial reactions with precision.

With a temperature range of -170 to 1200 °C, advanced load control, and rapid response systems, it accurately simulates service conditions of materials across various industries. Combined with EBSD and EDS, it provides comprehensive datasets for understanding material behavior under coupled stimuli.

 

Successfully applied in aerospace materials, new energy devices, and biomedical materials, this solution demonstrates CIQTEK’s exceptional compatibility and scalability in advanced electron microscopy platforms.

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High-Speed, High-Resolution 3D Reconstruction CIQTEK Volumetric Electron Microscopy Solution Unlocks New Dimensions in Biological Characterization

In life sciences, achieving high-precision and large-scale 3D structural and dynamic analysis of biological samples such as cells and tissues has become key to breaking through research bottlenecks. CIQTEK has introduced a multi-technology-route Volumetric Electron Microscopy (VEM) solution, integrating SS-SEM, SBF-SEM, and FIB-SEM. This provides an all-around, high-performance, and intelligent platform for biological 3D reconstruction, helping researchers uncover the micro-level mysteries of life.

 

Three Advanced Technical Routes

01. SS-SEM High-Speed Imaging
By combining external serial sectioning with the CIQTEK high-speed HEM6000-Bio SEM, this solution enables rapid imaging and automated acquisition of large-volume samples. Data acquisition efficiency is more than 5× higher than conventional SEM, supporting 24/7 unattended high-throughput operation.

 

02. SBF-SEM In-Situ Sectioning
Based on the CIQTEK ultra-high-resolution SEM5000X with an integrated microtome, this approach achieves in-situ sectioning and imaging cycles. It offers simple operation, high automation, and effectively avoids surface contamination.

 

03. FIB-SEM High-Precision Analysis
Leveraging focused ion beam–electron beam dual-beam systems, this route delivers nanoscale Z-axis resolution to analyze fine structures such as organelles and membranes. It enables in-situ 3D reconstruction without physical slicing.

 

Intelligent Integration & Broad Applications

The CIQTEK VEM solution deeply integrates AI algorithms and a multilingual software platform, supporting a full workflow from data acquisition, image alignment, and segmentation to 3D visualization. Compatible with mainstream reconstruction software, it significantly lowers the learning curve.

 

Application cases span neuroscience, cell biology, and pathogenic microbiology, offering a powerful tool for advancing life science research.

CIQTEK Volumetric Electron Microscopy (VEM) Solution

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CIQTEK Launches 8-inch Wafer Dual-Beam Solution for Full-Size Observation, Precision Cutting, and Comprehensive Processing

As semiconductor manufacturing advances to finer process nodes, wafer-level defect analysis, failure location, and micro-nano fabrication have become key to improving yield. CIQTEK introduces the 8-inch Wafer Dual-Beam Full-Size Processing Solution, combining high-resolution imaging and precise ion beam processing to achieve "observation-analysis-cutting" across the entire wafer, providing strong technical support for advanced semiconductor processes.

 

This solution features a 150mm long-stroke high-precision sample stage, enabling full-wafer, non-destructive observation and processing of 8-inch wafers. With an external optical navigation system and intelligent anti-collision algorithms, it ensures rapid and precise wafer positioning and safe operation. The system is equipped with a Schottky field emission electron gun, offering a resolution of 0.9 nm @ 15kV, and an ion beam resolution of 3 nm @ 30kV, capable of defect detection, cross-section slicing, and micro-structure fabrication at the nanoscale.

 

Core Advantages:

  • 150mm Travel Stage:
    • Combines long travel with high precision for an extensive observation range.

    • Excellent compatibility with different-sized fixtures.

    • Robust structure ensures wafer stability and quick, reliable loading.

  • 8-inch Quick Exchange:
    • Intelligent weight-bearing design with a sliding base for stability and durability.

    • Full-size compatibility: Supports 2/4/6/8-inch wafers.

    • Fast sample exchange: Vacuum pumping and sample loading within one minute.

  • Software and Anti-Collision:
    • Fully automatic intelligent navigation with accurate movement and positioning.

    • Multi-axis coordinated motion for full-wafer observation.

    • Smart anti-collision: Trajectory simulation and algorithmic spatial calculations to avoid risks.

    • Multiple real-time monitoring: Real-time multi-angle monitoring of wafer position.

  • External Optical Navigation:

    • Ultra-stable structure design suppresses image shake.

    • High-definition imaging with a precise field of view for full-wafer display.

    • Professional anti-glare lighting reduces wafer surface reflection.

 

Wafer observation range

Wafer observation range

 

CIQTEK Dual-Beam Electron Microscope Solution combines outstanding hardware with intelligent software systems, enabling efficient defect detection and process optimization through one-click brightness and contrast adjustment, auto-focus, and multi-format image output, empowering users to complete the full chain of tasks from defect discovery to process optimization.

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